A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers
Li Na XU, Jian Hui LIAO, Lan HUANG, Dan Lin OU, Kai Chang ZHOU, Hai Qian ZHANG, Ning GU, Ju Zheng LIU
A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers
Li Na XU, Jian Hui LIAO, Lan HUANG, Dan Lin OU, Kai Chang ZHOU, Hai Qian ZHANG, Ning GU, Ju Zheng LIU
中国化学快报
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2002, (07): 687
-688
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