A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers

Li Na XU, Jian Hui LIAO, Lan HUANG, Dan Lin OU, Kai Chang ZHOU, Hai Qian ZHANG, Ning GU, Ju Zheng LIU

中国化学快报 ›› 2002, Vol. 13 ›› Issue (07) : 687-688.
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A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers

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A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers

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