A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers

Li Na XU, Jian Hui LIAO, Lan HUANG, Dan Lin OU, Kai Chang ZHOU, Hai Qian ZHANG, Ning GU, Ju Zheng LIU

　

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Chinese Chemical Letters ›› 2002, Vol. 13 ›› Issue (07) : 687-688.
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A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers

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