Strain of 2D materials via substrate engineering

Yangwu Wu, Lu Wang, Huimin Li, Qizhi Dong, Song Liu

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Chinese Chemical Letters ›› 2022, Vol. 33 ›› Issue (01) : 153-162. DOI: 10.1016/j.cclet.2021.07.001
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Strain of 2D materials via substrate engineering

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{{article.zuoZheEn_L}}. {{article.title_en}}. {{journal.qiKanMingCheng_EN}}. 2022, 33(01): 153-162 https://doi.org/10.1016/j.cclet.2021.07.001

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